ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,103, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Metal wires with expanded sidewalls" was inv... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,104, issued on July 14, was assigned to STMicroelectronics (Rousset) SAS (Rousset, France). "Contact for electronic component" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,105, issued on July 14, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei City, Taiwan). "Forming method of interconnect stru... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,106, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,108, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method to improve interconnect coefficient of therma... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,109, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manufa... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,110, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Octagonal interconnect wiring for advanced l... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,111, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor structures including metal wir... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,112, issued on July 14, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.). "Method of forming copper interconnect struct... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,114, issued on July 14, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Contact pad structure and manufa... Read More